The high and low temperature test chiller of semiconductor power chip can provide users with a field source with controlled thermal cooling and uniform constant temperature, and can also be used as a heat source or cold source for direct heating, cooling, auxiliary heating and auxiliary cooling, and is used in petrochemical, pharmaceutical and other chemical reaction processes control.

1. Semiconductor power chip high and low temperature test The chiller adopts a certain process to interconnect components and wirings such as transistors, resistors, capacitors and inductors required in a circuit, and make them in a small or several small pieces of semiconductor wafers or dielectrics. on a substrate, and then encapsulated in a package into a miniature structure with the desired circuit functionality. All the components in the structure have formed a whole, which makes the electronic components take a big step towards miniaturization, low power consumption, intelligence and high reliability. Integrated circuit technology includes chip manufacturing technology and design technology, mainly reflected in processing equipment, processing technology, packaging and testing, mass production and design innovation capabilities.
2. From the perspective of the entire manufacturing process, integrated circuit testing includes design verification in the design stage, process inspection in the wafer manufacturing stage, wafer testing before packaging, and finished product testing after packaging, throughout design, manufacturing, packaging and application. It plays an important role in ensuring the performance of the chip and improving the operation efficiency of the industrial chain.
3. Also known as laboratory test or feature test, it is to verify whether the design is correct before the chip enters mass production, and requires functional testing and physical verification. In the test of the finished chip, part of the circuit will be damaged during the dicing, bonding, packaging and aging process of the subsequent process of the integrated circuit. Therefore, after the packaging and aging, the circuit performance test should be carried out on the finished circuit according to the test specifications. The purpose is to select qualified ones. The finished product is classified according to the parameter index of the device performance, and the number of each device and the statistical distribution of various parameters are recorded at the same time; according to these data and information, the quality management department supervises the quality of the product, and the production management department controls the production of the circuit.
4. The high and low temperature test of semiconductor power chips is a link in the production process of integrated circuits. The main purpose is to ensure that the chips can fully realize the functions and performance indicators specified in the design specifications in harsh environments, and to fully test the chips from all aspects, not only It can judge whether the chip performance meets the standard and whether it can enter the market, and can fully and quantitatively reflect various indicators of each chip from structure, function to electrical characteristics from the detailed data of the test results.